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Kuyera Kwambiri 99.95% Tungsten Sputtering Target

Kufotokozera Kwachidule:

Sputtering ndi njira yatsopano ya Physical Vapor Deposition (PVD).Sputtering imagwiritsidwa ntchito kwambiri mu: mawonedwe apansi, mafakitale agalasi (amaphatikizapo magalasi omanga, galasi lamoto, galasi lamoto), ma cell a dzuwa, uinjiniya wa pamwamba, zojambulira, ma microelectronics, magetsi amagalimoto ndi zokutira zokongoletsera, etc.


Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Mtundu ndi Kukula

Dzina lazogulitsa

Tungsten (W-1) sputtering target

Chiyero Chopezeka (%)

99.95%

Mawonekedwe:

Chozungulira, chozungulira, chozungulira

Kukula

OEM kukula

Malo osungunuka (℃)

3407 (℃)

Mphamvu ya atomiki

9.53 cm3 / mol

Kachulukidwe (g/cm³)

19.35g/cm³

Kutentha kokwanira kwa kukana

0.00482 I/℃

Kutentha kwa sublimation

847.8 kJ/mol (25 ℃)

Kutentha kobisika kwa kusungunuka

40.13±6.67kJ/mol

dziko pamwamba

Kusamba kwa Polish kapena alkali

Ntchito:

Zamlengalenga, kusungunula kwapadziko kosowa, gwero la magetsi, zida zamankhwala, zida zamankhwala, makina opangira zitsulo, kusungunula
zipangizo, mafuta, etc

Mawonekedwe

(1) Malo osalala opanda pore, zokanda ndi zina zopanda ungwiro

(2) Pogaya kapena m'mphepete, palibe zodula

(3) Lerel yosagonjetseka ya chiyero chakuthupi

(4) Kuthamanga kwambiri

(5) Homogeneous micro trucalture

(6) Chizindikiro cha laser cha Chinthu chanu chapadera chokhala ndi dzina, mtundu, kukula kwachiyero ndi zina zotero

(7) Ma PC aliwonse a sputtering chandamale kuchokera ku zinthu za ufa & nambala, ogwira ntchito osakaniza, outgas ndi nthawi ya HIP, makina opangira makina ndi kulongedza zambiri timadzipanga tokha.

Mapulogalamu

1. Njira yofunika kwambiri yopangira zinthu zokhala ndi filimu yopyapyala ndiyo spulattering—njira yatsopano ya physical vapor deposition (PVD).Filimu yopyapyala yopangidwa ndi chandamale imadziwika ndi kuchulukira kwakukulu komanso kumamatira kwabwino.Pamene njira za magnetron sputtering zikugwiritsidwa ntchito kwambiri, zitsulo zoyera kwambiri ndi aloyi ndizofunika kwambiri.Pokhala ndi malo osungunuka kwambiri, kusungunuka, kuchepa kwa mphamvu yowonjezera kutentha, resistivity ndi kukhazikika kwa kutentha kwabwino, tungsten koyera ndi tungsten alloy targets amagwiritsidwa ntchito kwambiri mu semiconductor Integrated circuit, mawonedwe amitundu iwiri, photovoltaic ya dzuwa, X ray chubu ndi zomangamanga pamwamba.

2.Itha kugwira ntchito ndi zida zonse zakale za sputtering komanso zida zaposachedwa kwambiri, monga zokutira m'dera lalikulu la mphamvu ya dzuwa kapena ma cell amafuta ndi mapulogalamu a flip-chip.


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